I-Red 3mm ye-LED esemgangathweni ye-Throguh-hole ye-Lens eDibeneyo

I-LED ebomvu engama-3mm esemgangathweni ene-lens ebomvu emngxunyeni

I-LED ebomvu engaphantsi iya kuba nobukhulu obahlukeneyo, i-3mm ubukhulu be-LED, i-5mm ubukhulu be-ect ect. Le 304RD yi-3mm ebomvu kwi-hole enemingxunya ene-cylinder ephezulu kunye nelensi ebomvu ebomvu. Sivelisa ezi zibane ze-LED zibomvu nge-625nm ye-LED chip ngaphakathi ukuze ikhuphe umbala. Xa sikhanyisa le LED encinci, iilensi ezibomvu ezahlukileyo ziya kwenza ukukhanya kube lula ngakumbi kwaye kungasasazeki. Ezenza ukuba le LED ilungele isalathiso se-LED. Siza kusebenzisa le LED ukuvelisa ibhodi ye-cuitcir indictor. Eyona mveliso iphambili ye-LED ibonelela ngowona mgangatho uphezulu, eyona nkonzo ibalaseleyo kunye nexabiso elikhuphisanayo. Ukuba ufuna ezinye ze-LED ebomvu yeprojekthi yakho. Zive ukhululekile ukunxibelelana nathi ~

Ubungakanani be-3mm nge-hole hole:

Iimpawu ezihamba nge-LED:

Ubukhulu beLens: 3mm;

* Kwamaza 620-630nm;

* Uhlobo lwelensi: Bomvu basasazeka;

* Ukunyaniseka okuphezulu kunye nokuqina okuphezulu kwemitha;

Iparamitha zombane:

* Ukuqhubela phambili kwimeko yangoku: Umsebenzi we-1% kunye nobubanzi be-pulse = 10us.

Imeko yokuSolder: Imeko yokuSolder kufuneka igqitywe ngamasekhondi ama-3 ngo-260 ℃

Iimpawu ze-Electrucal Optical (Tc = 25 ℃ )

* /1 / 2 yi-off-sxis angle apho ukukhanya okuqaqambileyo sisiqingatha se-axia ukukhanya okuqaqambileyo;

Isicelo esiphambili:

* Ilungele ukukhanya okungasemva;

* Ukukhanya kwesalathisi;

* Isibane sokuhombisa se-LED;

Iinkcukacha zeMveliso:

99,99% intambo yegolide esulungekileyo;

Isakhelo se-LED esenziwe ngesilivere;

Iichips ezaziwayo ezinophawu;

Umgangatho ophezulu we-epoxy;

Inkqubela phambili yokuvelisa i-LED emngxunyeni:

Thelekisa kunye ne-SMD ye-LED, ukuveliswa kwemingxunya ye-LED kuya kuba nzima. Oko kuthetha ukuba kuya kuthatha inkqubela phambili yemveliso kunye nexesha lokuvelisa:

Okokuqala, kufuneka silungiselele i-chip ye-LED (oku kuyakufana nemveliso ye-SMD ye-LED ); Okwesibini, kuya kufuneka sibeke i-chip ye-LED kwisakhelo se-LED, emva koko siyakufuna ucingo olucocekileyo lwegolide ukudibanisa i-cathode kunye ne-anode yesakhelo se-LED. Kuza ngokwahlukileyo, kwimveliso ye-SMD ye-LED, kufuneka sibeke i-epoxy kwisakhelo se-LED kwaye silinde de yome nge-oveni. Nangona kunjalo, kwizibane ze-LED, kufuneka sitofe i-epoxy ekubunjweni kwelensi kwaye sibeke zonke izinto ehovini ubuncinci iiyure eziyi-8 de zome. Emva koko, kufuneka sibacofe ehovini kwaye sikhuphe i-LED ngaphandle kwesikhunta. Kwaye emva koko kufuneka sisike izikhonkwane ze-LED ukuze kube lula ukuzivavanya.

Okokugqibela, siyifumene i-LED. Ukuze uqiniseke ukuba umgangatho kunye nomgangatho ofanelekileyo njengoko kufuneka. Kuya kufuneka sibeke zonke i-LED kumatshini wokwahlula kwaye siyakufumana i-LED ngemigqomo efanayo.

Imiqathango yokugcina:

1. kuthintele ukuvezwa okuqhubekayo kwimeko yokufuma yokugcina amanzi kwaye ugcine imveliso kude notshintsho olukhawulezileyo kubushushu bemo;

2. Ii-LED kufuneka zigcinwe kubushushu ≤30 ℃ kunye nokufuma okumalunga <60% ℃;

3. Imveliso kwiphakheji yokuqala etywiniweyo iyacetyiswa ukuba ihlanganiswe kwiiyure ezingama-72 zokuvulwa;

4. Imveliso kwiphakheji evuliweyo ngaphezulu kweveki kufuneka ibhakwe iiyure eziyi-6-8 nge-85-10 ℃;

INDLELA YOKUTHUTHA I-LED

I-1, i -lea d pitch ye-LED kufuneka ihambelane nomgangatho wemingxunya ekhulayo kwi-PCB ngexesha lokubekwa kwezinto ;

Ukwenziwa kwelothe kunokufuneka ukuba kuqinisekiswe ukuba inqaku lokukhokela lihambelana nomngxunya ;

Jonga lo mzobo ungezantsi weenkqubo ezifanelekileyo zokwenza inkqubo ;

Musa ukuhambisa umkhondo we-PCB kwindawo yoqhakamshelwano phakathi kwegama lesikhokelo kunye ne-PCB ukukhusela iisekethe ezifutshane ;

Qaphela:

Mount Indlela echanekileyo yokufaka;

× Indlela yokufaka engalunganga;

2. Xa iintambo ze-soldering kwi-LED, udibaniso ngalunye lwentambo kufuneka lubekwe ngokwahlukeneyo ngombhobho osasaza ubushushu ukuthintela ukunxibelelana kwesekethe emfutshane.

Sukuziqokelela zombini iingcingo kwityhubhu enye yokunciphisa ubushushu ukunqanda ukutswina izikhokelo ze-LED ;

Ukucofa uxinzelelo kwizikhokelo ezikhokelwayo kunokonakalisa ulwakhiwo lwangaphakathi kwaye kubangele ukusilela ;

Qaphela:

Mount Indlela echanekileyo yokufaka;

× Indlela yokufaka engalunganga;

3. Sebenzisa ii-stand-offs (Umzobo 3) okanye izithuba (Spacers 4) (ikhiwane lesi-4) ukubeka i-LED ngokhuseleko kwi-PCB ;

4. Gcina ubuncinane be-3mm cl ear phakathi kwesiseko se-lens ye-LED kunye nokugoba kokuqala (i-Fig. 5. Ikhiwane. 6)

5. Ngexesha lokwenziwa kwelothe, sebenzisa izixhobo okanye iijig ukubamba izikhokelo ngokukhuselekileyo ukuze amandla okugoba angadluliselwa kwilensi ye-LED nakwizakhiwo zayo zangaphakathi ;

Sukuyenza indawo ekhokelayo yakuba nje icandelo lifakwe kwi-PCB ;

L nethoba Owenza Iinkqubo

1. Iinkqubo zokwenza iNkokeli ;

2 . Musa ukugoba izikhokelo ngaphezu kokuphindwe kabini (umzobo 7 );

3. Ngethuba lokufaka i-soldering, amaqweqwe kunye nabanikazi kufuneka bashiye ukucoceka ukunqanda ukubeka uxinzelelo kwi-LED ngexesha le-soldering (Umzobo 8) ;

4. Incam yesinyithi esine-soldering akufuneki ichukumise i-lens epoxy ;

5. Ngombobo we-LED s awuhambelani ne-soldering ;

6. Ukuba i-LED iya kudlula kwi-soldering pass okanye ijongane nezinye iinkqubo apho icandelo linokuthi lifakwe kubushushu obukhulu nceda ujonge kwi-Best LED yokuhambelana ;