I-660NMM Red Chip 5730 SMD ikhokelwe

I-660NMP ye-LED kuthetha kuthetha ukuba ukukhanya kwe-diode ukuba nge-660nm Waveleth. Kodwa xa sicebisa nge-660NMM ekhokelwa, malunga ne-piak wavelength. Kwaye nganye ye-LED ye-LED inezabo zamandla. I-batch iphela ye-SMD ebomvu ikhokelwa nge-660nm. Kuya kubakho uluhlu kuyo. Kule-5730FR667p8l14p2, uluhlu lungama-665nm ukuya kwi-670nmm. Izibane ezingama-665nm ze-LED zihlala zisetyenziswa kwizibane zokhuselo ze-LED. Esi sithuba esithile senziwe ngaphakathi kwe-spectrum ebomvu kwaye yaziwa ngokukhuthaza i-photosynthesis kunye nentyatyambo kwizityalo. Inceda ekufumaneni amandla okukhanya efunekayo kukukhula kwezityalo nophuhliso. Ke ngoko, izibane ze-665nm ze-665nm zisetyenziswa ngokubanzi kwigadi yangaphakathi yegadi kunye nokulima kwentengiso yokuhlakulela iintlobo zezityalo.

Iimeko zokugcina:

1. Kulumkele ukuveza ukuqhubeka kwendawo yokufumanisa umswakama kwaye ugcine imveliso ikude kwimveliso ekhawulezileyo kumaqondo obushushu aphantsi;

2. I-LEDS kufuneka igcinwe ngamaqondo obushushu ≤30 ℃ kunye nokufuma okuhambelana <60% ℃;

3. Imveliso kwiphakheji etywiniweyo yoqobo iyacetyiswa ukuba ihlanganiselwe kwiiyure ezingama-72 zokuvula;

4. Imveliso kwipakethi evuliweyo ngaphezulu kweveki kufuneka ibhakwe iiyure eziyi-6-8 nge-85-10 ℃;

Indlela yokunyuka ye-LED ye-LED

1, Isigqubuthelo esikhokelayo se-LED kufuneka sihambelane ne-pitch yemingxunya yokunyuka kwi-PCB ngexesha lokubekwa kwecandelo;

Ukuqulunqwa kwe-Comman kunokucelwa ukuba inyanzelise i-pitch ekhokelayo ihambelana ne-Hitch yeHit;

Bhekisa kumzobo ongezantsi kwinkqubo efanelekileyo yokwenza;

SUKUKHO nto i-PCB TRACE kwindawo yoqhakamshelwano phakathi kweNqweno kunye nePCB ukukhusela isekethe elifutshane;

Iqatshelwe:

Indlela efanelekileyo yokunyuka;

Indlela yokunyuka engalunganga;

2. Xa i-wimi ethengiswayo kwi-LED, i-wire nganye yocingo kufuneka ifakwe ngokwahlukeneyo ityhubhu yokutshiswa kobushushu ukuthintela unxibelelwano lwesekethe olufutshane.

Sukuthintela iingcingo zombini kubushushu obunye obushushu ukunqanda ukuthoba isikhokelo se-LED;

Ukutyhila uxinzelelo kwizifundo ze-LED kunokulimaza izakhiwo zangaphakathi kwaye zibangele ukusilela;

Iqatshelwe:

Indlela efanelekileyo yokunyuka;

Indlela yokunyuka engalunganga;

3. Sebenzisa i-STA-OFFS (FIG 3) okanye iiSpacer (Fig 4) ukukhusela i-LED engaphezulu kwePCB;

4. Gcina ubuncinci ukucocwa kwe-3mm phakathi kwesiseko se-lens ye-LED kunye ne-Comple Town Bind (Fig. 5. Umzobo 6)

5. Ngexesha lokwakha, ukusebenzisa izixhobo okanye i-jigs ukubamba izizathu zikhokelela ngokukhuselekileyo ukuze amandla okuhlamba akasayi kudluliselwa kwilensi ye-LED kunye nezakhiwo zayo zangaphakathi;

Sukwenza ukwenziwa kokukhokelela xa icandelo libekwe kwi-PCB;

Iinkqubo zokwenza i-EAD

1. INKCAZO YOKUQHUTYELWA YOKUGQIBELA;

2. Musa ukugoba okukhokelela ngaphezulu kwe (Fig. 7);

3. Ngexesha lokuthengiswa, umbutho ogubungelweyo kunye nabanini manini mabaphume ekuvumeni ukunqanda ukubeka uxinzelelo kwi-LED ngexesha elisemthethweni (Fig 8);

4. Inzuzo yentsimbi engekhoyo akufuneki ichukumise i-appoxy yelensi;

5. Ngokusebenzisa i-LED-hole ayihambelani nokuthengiswa okuvunileyo;

6. Ukuba i-LED iya kuqhubeka idluliselwe kwi-tsods ezininzi okanye ijonge ezinye iinkqubo apho inxenye inokuthi ifakwe khona ubushushu obukhulu nceda jonga ngokuhambelana;